ZURICH, Switzerland, April 08, 2025 (GLOBE NEWSWIRE) -- QuantalRF, the pioneering developer of RF semiconductor and antenna solutions, samples its innovative Wi-Fi 7 CMOS front-end module (FEM) to two Tier-1 mobile SoC players. The QWX27120, a 5-7 GHz CMOS FEM designed for Wi-Fi 7, fully integrates a patent-pending power amplifier (PA) architecture, an SP3T switch, and a low-noise-amplifier (LNA) into a monolithic CMOS die. Optimized for Wi-Fi 7 applications in smartphones, AR/VR, tablets, laptops and smart home devices, this all-silicon solution outperforms competing GaAs and SiGe products in power efficiency, size, RF performance, and cost.

The QWX27120, part of the QuantalRF Elementum™ family of Wi-Fi 7 products, builds on the success of the its predecessors with enhanced features, including a power detector output. Fabricated in CMOS SOI technology, the QWX27120 leverages QuantalRF’s unique PA architecture to reduce power consumption, enabling devices to achieve a longer battery life and reduce heat dissipation. The CMOS FEM also enables a high degree of on-chip configurability, allowing for the versatile reconfiguration for different supply voltages, channels, and linear/non-linear operational modes. Selectable high/low transmit gain modes and digital pre-distortion (DPD) further improve power efficiency.

'Wi-Fi 7’s advanced features and higher data rates pose significant power consumption challenges,' said Dr. Ali Fard, CEO and CTO of QuantalRF. 'Our innovative PA architecture—integrated within a monolithic CMOS SOI platform—delivers superior linear output power and best-in-class power efficiency. With the QWX27120 Wi-Fi 7 FEM now sampling, we are ready to collaborate with more customers to turbocharge their Wi-Fi efficiency with intelligent and adaptive technology.'

QWX27120 Features & Benefits:

• Wi-Fi 6E and Wi-Fi 7 compatible – supports 5150–7125 MHz
• Superior power efficiency – reduces power consumption by up to 50-percent
• Power detector output – provides real-time power monitoring
• Ultra-small form factor – integrates all RF front-end components into a single die, available in a 2 x 2mm LGA package or as a flip-chip die.

Samples and evaluation kits are now available. Contact QuantalRF for more information.

About QuantalRF AG
QuantalRF is transforming the RF signal chain for wireless communications to deliver an unmatched user experience. Its ultra-compact, highly configurable front-end ICs and extremely efficient antennas substantially improve area, cost, power, and overall performance. Headquartered in Zürich, Switzerland, with R&D centers in the USA and Sweden, QuantalRF has an extensive portfolio of over 200 patents. For more information, visit www.quantalRF.com.

Forward-Looking Statements
This announcement contains forward-looking statements that reflect our current expectations and projections about future events. These statements are not guarantees of future performance and are subject to risks, uncertainties, and other factors that may cause our actual results to differ materially. We undertake no obligation to update any forward-looking statements. A non-exclusive list of risk factors may be found on our website at www.quantalRF.com/forward-looking-statement.

Media Contact:
Dave Aichele
EVP Sales & Business Development
dave.aichele@quantalrf.com
+1 858-401-6444